Research by SUNY Polytechnic Institute (SUNY Poly) President Dr. Winston Soboyejo and peers at Worchester Polytechnic Institute (WPI) titled “Interfacial Fracture of Perovskite Light Emitting Devices” has been published in the journal Extreme Mechanics Letters. The study provides crucial insights into the fracture behavior of Perovskite Light Emitting Devices (PLEDs), highlighting the significance of interfacial toughness in device performance, which can shape future materials and interface engineering strategies in optoelectronic devices.
Understanding the interfacial fracture toughness of PLEDs can lead to the development of more robust devices by enhancing the adhesion between layers and minimizing defect propagation. This enhancement can result in improved performance and durability of PLEDs.
Dr. Soboyejo’s journey in studying the mechanics of interfacial failure began around 30 years ago. In the early 2000s, he collaborated with Steve Forrest and two former Ph.D. students on a pressure-assisted method for fabricating light emission devices, leading to a patented cold-welding method licensed by Samsung for manufacturing LEDs. Later, with Princeton electrical engineering Ph.D. student Tiffany Tong, he explored interfacial failure in organic light-emitting devices, developing the experimental approaches used in the current study.
In this latest research, Dr. Soboyejo supervised WPI Ph.D. student Jaya Cromwell and post-doc Reisya Ichwani in examining interfacial failure and toughening in next-generation light-emitting devices. The findings have already led to a published patent for pressure-assisted fabrication of light-emitting devices and solar cells.
The study underscores the importance of interfaces in perovskite optoelectronic devices, as defects at interfaces can trap carriers and degrade performance. Strategies to enhance interface adhesion, such as inserting interlayers or using self-assembled monolayers, have shown promise in improving device performance and reducing degradation. The research uses Brazil disk testing to measure interfacial fracture toughness, providing insights that are vital for designing mechanically robust PLEDs.
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